Engineers who shipped the silicon first.
A custom-silicon partner for the edge AI era. Founded by veterans of TSMC, UMC, GUC, Faraday, ITRI, SpringSoft and Cadence. Two decades of tape-outs, now building the tool we always wanted.
From innovation to renovation.
Edge AI moves out of the demo.
Into robots, cameras, sensors, scanners.
Standard SoCs leave value on the table.
Application insight closes the gap.
The old industries get rebuilt.
Manufacturing, logistics, healthcare, agriculture.
Custom silicon is the lever.
We make it buildable.
How we build. No exceptions.
Automatic, not assisted.
The tool finishes the job.
Architecture-level.
Above RTL. Always.
Reuse by default.
Methodology compounds.
Transactions over waveforms.
Insight, not noise.
Platform-led. Project-driven.
Platform-led.
Three tools — XACT-Forge, VerifAi, DeVign — carry the load across every engagement.
Project-driven.
Our engineers ship the chip with you. Advisory to full ASIC program.
Application-aware.
Architecture explored against your workload. Not a generic template.
The people behind the tool.
K · 01
25 years in semi. 30 issued patents.
R · 02
System-level design. Chair, DVCon Taiwan 2025.
S · 03
Engineering operations and delivery.
D · 04
SVP, GPU Tech & Engineering at AMD.
H · 05
VLSI, automation, formal verification.
T · 06
CMO SEMI Global · CEO SEMI Taiwan.
What we hold. In every review.
Technical honesty.
Clear tradeoffs. Not inflated claims.
Execution speed.
Discipline at every milestone. Tape-out is the deadline.
Customer differentiation.
Your application stays yours. We ship the silicon that carries it.
System-level thinking.
Sensors, data path, compute, software. One coherent design.
The tool we wish we had.
Built for the next ten chips.
See it in action.