From application insight to silicon.
Four service lines. Three tools underneath. Engineers who shipped at TSMC, UMC, GUC, Faraday.
Four lines. One arc.
IP blocks to coherent SoC. XACT-Forge parses the spec, infers the bus types and address maps, and emits IP-XACT 1685. Engineers close the rest.
- SoC block architecture
- IP selection and integration plan
- Interconnect and memory planning
- Performance and constraint analysis
- Integration-ready design structure
Plan, framework, reusable components. VerifAi writes the UVM testbench, the C reference, the directed and random tests, and the coverage map — against your spec, not your testbench. 16 person-months replaces 80–120.
- Verification strategy
- UVM testbench framework
- Reusable verification components
- Early validation infrastructure
- Coverage-oriented planning support
Prove the unit economics first. Validate on FPGA. Ship as SiP when volumes are early. Move to ASIC when the math agrees.
- FPGA-oriented integration support
- Prototype system planning
- Package-level concept exploration
- Transition planning toward ASIC
Front-end to foundry sign-off. Senior engineers who have taped out at TSMC, UMC, GUC, and Faraday run the program. Shipped silicon, not slides.
- ASIC development planning
- Front-end and back-end coordination
- Verification and bring-up support
- Foundry and ecosystem interface
- Production-readiness planning
Pick the shape. Skip the procurement theatre.
Advisory & feasibility
Short-form reviews. Architecture sanity checks. Spec critique before you commit.
Paid architecture
Scoped architecture and partitioning study. Tradeoffs in writing. Numbers, not slogans.
Joint development
Co-located teams. Our engineers in your repo. Shared milestones, shared sign-off.
Milestone silicon
FPGA, SiP, ASIC — billed at milestones. Each gate has a deliverable. Each deliverable runs.
Long-term partnership
Day one to retirement. Spec, tape-out, bring-up, field, end-of-life. We are still there.
Describe the scope.
We'll read the spec and write back.
Senior engineers, Hsinchu-based. Tape-outs at TSMC, UMC, GUC, Faraday.